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M393A4K40EB3-CWE

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Introduction

The Samsung M393A4K40EB3-CWE is a 32GB DDR4-3200 ECC Registered DIMM for compatible enterprise servers. Its 2Rx4 organization is a key selection detail: two memory ranks are built from x4-width DRAM devices, so buyers should match more than capacity and speed when replacing an existing server DIMM.

Intel DDR4 RDIMM validation results list this model with CL22 timing, a B2 raw-card layout, and Samsung K4A8G045WE-BCWE 8 Gb x4 DRAM. These part-level identifiers are useful for procurement and maintenance teams that need to distinguish the exact module from 32GB DDR4-3200 RDIMMs using x8 devices or a different raw-card design.

At 3200 MT/s, DDR4-3200 provides up to 25.6 GB/s of theoretical transfer bandwidth per 64-bit memory channel. The installed speed still depends on the processor generation, BIOS qualification, memory-channel population, and DIMMs-per-channel configuration of the server.

The x4 device width deserves attention during compatibility checks. Some server platforms qualify x4 and x8 RDIMMs separately, and support for specific memory RAS features can depend on the platform and DRAM organization. For that reason, a 32GB 2Rx4 module should not be treated as automatically interchangeable with a 32GB 2Rx8 RDIMM simply because both are rated at 3200 MT/s.

For exact-part sourcing and server memory configuration support, we at Huaying Hengtong assist customers with enterprise server memory requirements.

Before installation, compare the existing DIMMs by module type, capacity, rank count, device width, speed, and part number. Also confirm the server vendor’s population rules. When DDR4-3200 is mixed with slower qualified memory, many platforms operate the populated channel at the highest common supported speed rather than keeping each DIMM at its individual rating.

Specifications

Product Model

M393A4K40EB3-CWE

Memory Type

DDR4

Module Type

Registered DIMM / RDIMM

Application

Server

Capacity

32GB

Memory Speed

3200 MT/s

Speed Classification

DDR4-3200 / PC4-25600R

Memory Organization

2Rx4

DRAM Component

Samsung K4A8G045WE-BCWE / 8 Gb x4

Error Correction

ECC Supported

CAS Latency

CL22

Operating Voltage

1.2V

Form Factor

288-pin DIMM

Introduction

Key Product Features

2Rx4 Organization for Exact Replacement

M393A4K40EB3-CWE uses a dual-rank x4 architecture. For service replacements or capacity expansion, matching the 2Rx4 topology helps preserve the memory organization already validated in the system and reduces the risk of unintentionally changing rank or device-width characteristics.

8 Gb x4 DRAM and B2 Raw-Card Identification

Intel validation data identifies Samsung K4A8G045WE-BCWE 8 Gb x4 DRAM and a B2 raw-card layout for this model. These identifiers provide a more precise BOM check than a generic “32GB DDR4-3200 ECC RDIMM” description, especially when multiple Samsung 32GB server-memory variants are available.

32GB Capacity with DDR4-3200 CL22

The module combines 32GB per DIMM with DDR4-3200 speed and CL22 timing. This capacity is practical for servers that need to increase installed memory without immediately consuming every available slot, provided the processor and platform support 32GB RDIMMs at the intended population level.

Compatibility Before Mixing or Upgrading

RDIMM, LRDIMM, and UDIMM are different module types. They should not be mixed. This holds true unless the server documentation clearly permits the configuration. For this 2Rx4 RDIMM, check processor support first. Next check BIOS level. Also check channel balance. Check DIMMs per channel. And check the rank/device-width pattern of existing memory. Do all this before deployment.